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|Application:||248nm Lithography Process And Mixed With Halogen Using Mixed Gases||CAS No.:||7439-90-9|
|Package::||Seamless Steel Cylinders||Other Names:||Oxygen Carbon Tetrafluoride Mixture|
|Appearance::||Colorless Gas||Cylinders Volume::||10L,25L, 40L Or 50L|
|Grade Standard:||Electron Grade Grade||Toxic:||Non-toxic|
UN 1982 Specialty Gas Mixtures 20% Oxygen With Carbon Tetrafluoride
Specialty Gas Mixtures
Carbon Tetrafluoride is a source of fluorine or carbon fluoride free radicals used in a variety of wafer etchprocesses. Carbon Tetrafluoride is used with oxygen to etch polysilicon, silicon dioxide, and silicon nitride.
Carbon Tetrafluoride is relatively inert under normal conditions and is an asphyxiant. Under RF plasma conditions, the fluorine free radicals are typically in the form of CF3
or CF2. A higher purity CarbonTetrafluoride results in superior control of the process, which results in better dimensional and profile control.
Other halocarbons, as well as the presence of air or oxygen, are detrimental to the control of the anisotropic etch.
1. Physical properties
2. Typical technical data (COA)
|Carbon Dioxide (CO2)||<1.0|
|Carbon Monoxide (CO)||<1.0|
|THC (as Methane) (CH4)||<0.5|
|Cylinder||Valve Outlet Options||Pounds||PSIG||BAR|
|2||CGA 580||DISS 716||70||2000||139|
Tetrafluoromethane is sometimes used as a low temperature refrigerant.
It is used in electronics microfabrication alone or in combination with oxygen as a plasma etchant for silicon, silicon dioxide, and silicon nitride.
It also has uses in neutron detectors