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C4F6 Gas Hexafluoro-1,3-Butadiene Electronic Gases For Research Chemical Laboratory

Basic Information
Place of Origin: CHINA
Brand Name: Accept OEM
Certification: ISO9001
Model Number: NO
Minimum Order Quantity: 30KGS
Price: negotiation
Packaging Details: 30lb - 926L Cylinder package
Delivery Time: 6-10 DAYS
Supply Ability: 50TON
Detail Information
CAS No.:: 685-63-2 Other Names:: 1,1,2,3,4,4-hexafluorbuta-1,3-dieen
Hazard Class : 2.3 Place Of Origin:: Hubei
Purity:: 99.95% Application:: Fluorocarbon-based Plasma Etching 
Package:: Seamless Steel Cylinders Cylinders Volume:: 926L
High Light:

electric gas

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purity plus specialty gases


Product Description

 C4F6 gas,Hexafluoro-1,3-butadiene for research chemical laboratory

 

Description:

 

Hexafluoro1,3‐butadine is a toxic, colorless, odorless, flammable liquefied compressed gas.

 

C4F6 gas as an etchant gas for a high aspect ratio contact hole etching can be a good

alternative to PFC gases.

 

hexafluoro-1,3-butadiene (C4F6) dry etching gas it has developed in Russia. C4F6 enables dry etching at a line width of as narrow as 90 nm or less. It is therefore indispensable for processing system LSIs and high-speed, large-capacity memory devices that are increasingly used in digital electric appliances and liquid crystal displays.

 

Fluorocarbon gases are widely used for processing silicon oxide film. Compared with octafluorocyclobutane (C4F8) currently used for processing at the line width of 130 nm, C4F6 has the following advantages:

 

1.Very low environmental load as it is decomposed in less than two days in the atmosphere (compared with 3,200 years for C4F8)

 

2.Therefore, useful as an alternative to perfluorocarbons with high global warming potential.

 

3.High aspect ratio, resulting in narrow and deep grooves (suitable for processing at very narrow line width).

 

4.High selectivity (ensures etching of silicon oxide film only; does not affect photoresist, silicon substrate or nitride film)

C4F6 Gas Hexafluoro-1,3-Butadiene Electronic Gases For Research Chemical Laboratory 0

PHYSICAL AND CHEMICAL PROPERTIES

APPEARANCE AND ODOR GAS @ 25 °C AND 760 mmHg.
MELTING POINT: -132.1 °C
BOILING POINT 6 -7 °C @ 760 mmHg
VAPOR PRESSURE: 25 psia @ 20 °C
DENSITY: 1.553 g/mL @ -20 °C
REFRACTIVE INDEX: 1.378 @ -20 °C

 

STANDARD PACKAGE INFORMATION—ASIA AND NORTH AMERICA

Container Size 44L Steel 8L Steel
Fill Weights(kgs) 45 5
Valve ConnecƟon PneumaƟc DISS 724 Manual DISS 724
Cylinder Dimensions(in) 9x51 7x19

 

 

Applications:

1. It can use in fluorine-based etching.

2. C4F6 can use as organometallic film forming gases.

 

 

 

Contact Details
Vicky Liu

Phone Number : 86-27-82653381

WhatsApp : +8613667126861