|Brand Name::||Accept OEM, CUSTOMER BRAND||Other Names::||HFB|
|Hazard Class :||2.3||Place Of Origin::||Wuhan|
|Package::||Drum And Cylinder||Cylinders Volume::||30lb,50lb, 40L And 926L Cylinder|
purity plus specialty gases
C4F6 purity 99.95% Etching Gas for Semiconductor Processing
hexafluoro-1,3-butadiene (C4F6) dry etching gas it has developed in Russia. C4F6 enables dry etching at a line width of as narrow as 90 nm or less. It is therefore indispensable for processing system LSIs and high-speed, large-capacity memory devices that are increasingly used in digital electric appliances and liquid crystal displays.
Fluorocarbon gases are widely used for processing silicon oxide film. Compared with octafluorocyclobutane (C4F8) currently used for processing at the line width of 130 nm, C4F6 has the following advantages:
STANDARD PACKAGE INFORMATION—ASIA AND NORTH AMERICA
|Container Size||44L Steel||8L Steel|
|Valve ConnecƟon||PneumaƟc DISS 724||Manual DISS 724|
1. It can use in fluorine-based etching.
2. It also can use in cleaning gases,
3. C4F6 can use as organometallic film forming gases,