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Electronic Purity Plus Specialty Gases C4F6 For TFT - LCD Manufacturing

Basic Information
Place of Origin: shandong
Brand Name: OEM
Certification: ISO9001
Model Number: N/M
Minimum Order Quantity: 100 KGS
Price: negotiation
Packaging Details: 30lb - 926L Cylinder package
Delivery Time: 7-10 DAYS
Payment Terms: Western Union, L/C, T/T
Supply Ability: 50TON
Detail Information
Odor:: Odorless Color: Colorless
Air & Water Reactions: HIGHLY FLAMMABLE GAS. VERY TOXIC. VERY TOXIC BY INHALATION. RISK OF EXPLOSION IF HEATED UNDER CONFENEMENT. Cylinders Certificate:: GB, ISO, CE, DOT
Supply Ability:: 30 Ton Per Month Application:: Semi Industry
Package:: 30-1000kg/per Cylinder Cylinders Volume:: 30LB,50LB Disposable Cylinder
High Light:

electric gas

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purity plus specialty gases


Product Description

Electronic Specialty Gases C4F6 Used During Semiconductor Fabrication And The manufacturing of TFT-LCDs

 

Description:

 

C4F6 is a new environmentally friendly, high-performance , etch chemistry for its Dielectric Etch IPS(TM) Centura(R) and Dielectric Etch Super e(TM) Centura systems. The C4F6 gas can provides higher etch rates, better profile control and higher selectivity to photoresist in critical dielectric etch applications.

 

C4F6 gas improves dielectric etch process results in key areas such as copper dual damascene, self-aligned contact and high aspect ratio contact etch applications, including low K materials. It also exhibits significant environmental benefits over current etch chemistries.

The semiconductor industry has been investigating new gas chemistries in an effort to reduce global warming emissions. In addition to improving etch process performance, C4F6 gas features low global warming emissions and zero ozone depletion potential.

 

Electronic Purity Plus Specialty Gases C4F6 For TFT - LCD Manufacturing 0

 

High Pressure Gas
Molecular Weight 162.03
UN Code 3160
Permissible Concentration Unsettled(Reference value5ppm)
Description Colorless Gas
Odor Odorless
Specific Gravity 5.892
Boiling Point 5.5℃
Density(Liquid) 1.44kg/ℓ(15℃)

 

Applications:

 

1. C:F ratio in C4F6molecule is high enough to control the amount of polymer on the chamber surface and wafer surface with respect to F etching radicals so achieving superior results over other gases to produce vertical profile. More important, its intrinsic characteristics allow high selectivity to substrate or photoresist and wider process window compared to C4F8.

 

2. This behaviour is particularly beneficial to address the need for sub 0.25 m requirements. Ar is being used as a carrier gas but nitride selectivity results a decreasing function for Ar.

Contact Details
Vicky Liu

Phone Number : 86-27-82653381

WhatsApp : +8613667126861