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Odorless C4F6 Gas Environmentally Friendly Pure Gas Products For Etch Chemistry

Basic Information
Place of Origin: shandong
Brand Name: OEM
Certification: ISO9001
Model Number: N/M
Minimum Order Quantity: 100 KGS
Price: negotiation
Packaging Details: 30lb - 926L Cylinder package
Delivery Time: 7-10 DAYS
Payment Terms: Western Union, L/C, T/T
Supply Ability: 50TON
Detail Information
Odor:: Odorless Color: Colorless
Air & Water Reactions: HIGHLY FLAMMABLE GAS. VERY TOXIC. VERY TOXIC BY INHALATION. RISK OF EXPLOSION IF HEATED UNDER CONFENEMENT. Cylinders Certificate:: GB, ISO, CE, DOT
Supply Ability:: 30 Ton Per Month Application:: Semi Industry
Package:: 30-1000kg/per Cylinder Cylinders Volume:: 30LB,50LB Disposable Cylinder
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Product Description

C4F6 Gas Environmentally Friendly Gas For Etch Chemistry

 

Description:

 

Hexafluoro-1,3-butadiene (C4F6) is a relatively new etch gas for the manufacturing of semiconductor devices, especially in critical etch processes that need high aspect ratios and selectivity. It is able to combine very high performance with a benign environmental effect. This gas has become available on an industrial scale only recently and we felt the need to increase the data in our possession on its behavior both in the plasma chamber and in the gas delivery systems.

 

Ion intensities, and absolute total ion current densities measured both for discharge generated in pure C4F6 and in mixture with Argon. In addition, the ratio of radical densities relative to CF measured using sub-millimeter absorption spectroscopy and optical emission spectroscopy measurements are presented for several gas pressures and gas mixture ratios. A comparison with c-C4F8 is made.

 

The material compatibility of this gas, which show how this 'exotic' gas can be handled with standard materials.The most significant benefits of C4F6 gas become evident from its demonstrated performance for a range of increasingly demanding advanced etch processes that require concomitant high selectivity to 193 nm photoresists, hardmasks, and a variety of underlayers while preserving critical dimension and profile control. Advantages of C4F6 based etch processes, such as high aspect ratio contact/via etch, high selectivity mask open, and dual damascene etch processes, developed on an Applied Materials dielectric etcher, and analyses of PFC emissions data are discussed.

Odorless C4F6 Gas Environmentally Friendly Pure Gas Products For Etch Chemistry 0

STABILITY AND REACTIVITY

STABILITY STABLE: STABLE UNDER RECOMMENDED STORAGE CONDITIONS. MATERIALS TO AVOID: STRONG OXIDIZING AGENTS. CONDITIONS TO AVOID: DO NOT PIERCE OR BURN, EVEN AFTER USE. DO NOT SPRAY ON A NAKED FLAME OR ANY INCANDESCENT MATERIAL. HEAT, FLAMES AND SPARKS.
HAZARDOUS DECOMPOSITION PRODUCTS HAZARDOUS DECOMPOSITION PRODUCTS: CARBON OXIDES, HYDROGEN FLUORIDE.
HAZARDOUS POLYMERIZATION HAZARDOUS POLYMERIZATION: WILL NOT OCCUR.

 

TOXICOLOGICAL INFORMATION

ROUTE OF EXPOSURE INHALATION: VERY TOXIC IF INHALED. SKIN: MAY BE HARMFUL IF ABSORBED THROUGH SKIN. MAY CAUSE SKIN IRRITATION. MAY CAUSE FROSTBITE. EYES: MAY CAUSE EYE IRRITATION.
SIGNS AND SYMPTOMS OF EXPOSURE TO THE BEST OF OUR KNOWLEDGE, THE CHEMICAL, PHYSICAL, AND TOXICOLOGICAL PROPERTIES HAVE NOT BEEN THOROUGHLY INVESTIGATED.

Applications:

1. A new generation of semiconductor etching gas.

2.Perfluorocarbon Alternative Gas Plasmas for Contact Hole Etch.

3.Plasma Etching Processes for Sub-quarter Micron Devices:

Contact Details
Vicky Liu

Phone Number : 86-27-82653381

WhatsApp : +8613667126861