Appearance:: | Gas | Color: | Colorless |
---|---|---|---|
Odor:: | Odorless | Molecular Weight:: | 162.03 G/mol |
Melting Point / Freezing Point:: | -130 C | Boiling Point / Boiling Range:: | -5.5 C |
Flash Point:: | ./. | Chemical Name:: | Hexafluoro-1,3-butadiene |
High Light: | electric gas,purity plus specialty gases |
C4F6 Etching Gas for Semiconductor Processing
Description:
C4F6 (Hexafluoro-1,3-butadiene) is used for dielectric etch applications. Hexafluoro-1,3-butadiene is a toxic, colorless, odorless, flammable liquefied compressed gas.
Package:44~49L cylinder, CGA350 SS valve
Filling content: 20kg/cyl
C4F6, is an environmentally friendly, high-performance semiconductor fabrication specialty gas that
provides high etch rates, good aspect ratio control and high selectivity to
photoresist in critical dielectric etch applications.
C4F6 gas improves dielectric etch process results in many key processing areas, including copper dual damascene applications and low K dielectric materials for 0.13 micron and beyond chip designs. Sifren 46 also provides environmental advantages in low global warming emissions and zero
ozone depletion potential.
PHYSICAL AND CHEMICAL PROPERTIES
APPEARANCE AND ODOR | GAS @ 25 °C AND 760 mmHg. |
MELTING POINT: | -132.1 °C |
BOILING POINT | 6 -7 °C @ 760 mmHg |
VAPOR PRESSURE: | 25 psia @ 20 °C |
DENSITY: | 1.553 g/mL @ -20 °C |
REFRACTIVE INDEX: | 1.378 @ -20 °C |
STANDARD PACKAGE INFORMATION—ASIA AND NORTH AMERICA
Container Size | 44L Steel | 8L Steel |
Fill Weights(kgs) | 45 | 5 |
Valve ConnecƟon | PneumaƟc DISS 724 | Manual DISS 724 |
Cylinder Dimensions(in) | 9x51 | 7x19 |
Applications:
1. Plasma Etching Processes for Sub-quarter Micron Devices.
2. Perfluorocarbon Alternative Gas Plasmas
3. Used in TFT-LCDs and photovoltaics.